Enhanced the function of "FineSAT Ⅲ".
FineSAT7 is the latest model that enables one-time inspection of large devices such as 300mm (12-inch) wafers using the through transmission method, in addition to improving the defect detection image quality of semiconductor devices and electronic components becoming finer and more multilayered.
FineSAT Ⅴ is equipment with a maximum scanning speed of 2,000 mm/s and dramatically increased measurement data points.
FineSAT Ⅲ is equipment that enables high resolution and speed-up; it works only with a single-probe and fulfills the basic functions.
This high-grade model of FineSAT has higher resolution while retaining the other original functions.
FineSAT Hybrid can provide both high-resolution single probe scanning and high-speed image-displaying electronic scanning in one unit.
This high throughput equipment can display real-time images using the electronic scanning system.
These are wafer-exclusive models that handle both single probe scanning and electronic scanning, and can also be used in a clean room.
